SBA closes Series C financing round with new investors Samsung Venture Investment Corporation (SVIC) and Sun Mountain Capital

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SBA Materials Inc., a leader in development of engineered nano-structured material, has announced the successful closing of its Series C financing round. New investors in this round were Samsung Venture Investment Corporation (SVIC) and Sun Mountain Capital. Also participating were existing investors: SBA’s co-founder William Cook, Intel Capital, Southern Cross Venture Partners and Rock Hankin. Dong-Su Kim, Vice President at SVIC, will join SBA’s board of directors.

SBA plans to use the proceeds from this financing round to accelerate the commercialization of its Liquid Phase Self Assembly (LPSA) based ultra low-k dielectric coatings as well as extend its product portfolio to address applications beyond the semiconductor devices market.

“We see great promise for the LPSA material platform, not just in semiconductors, but also in various applications including displays. We expect that this round of investment will accelerate the development and wide spread adoption of the materials.” Said Dong-Su Kim, Vice President at SVIC”

Press Release